西安紫光国芯半导体股份有限公司Xi’an UniIC Semiconductors Co., Ltd.

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西安紫光国芯半导体股份有限公司前身为建立于2004年德国英飞凌西安研发中心的存储奇迹部，2006年分拆成为自力的奇梦达科技西安有限公司，2009年被浪潮团体收买转制成为国内公司并更名为西安华芯半导体有限公司。2015年，紫光团体紫光国芯微电子股份有限公司收买西安华芯半导体有限公司并更名为西安紫光国芯半导体有限公司。2019年12月，经太重组，西安紫光国芯半导体并入北京紫光存储科技有限公司。2022年紫光团体实控人变更加智广芯控股，随着紫光团体重整终了，西安紫光国芯踏上成长新征程。

公司是以DRAM（静态随机存取存储器）存储技术为焦点的产物和办事供给商，焦点营业包括标准存储芯片，模组和系统产物，嵌入式DRAM和存储控制芯片，以及公用集成电路设想开辟办事，产物包括DRAM KGD、DRAM颗粒、DRAM模组、系统产物和设想办事。今朝公司员工人数跨越600名，其中研发工程师占比80%以上，70%具有硕士或博士学位。公司还具有二十余位外籍专家和外洋留学归国职员。

Xi’an UniIC Semiconductors Co., Ltd. (“Xi’an UniIC” in short) was originally the Memory Division of Xi’an R&D Center of Infineon Technologies established in 2004. The memory division became an independent company Qimonda Technologies (Xi’an) Co., Ltd. after its spin-off in 2006. The entity was acquired by Inspur Group due to Qimonda worldwide insolvency and started as a local company Xi’an Sinochip Semiconductors Co., Ltd. in 2009. In 2015, the company was taken over by Tsinghua Unigroup and renamed as Xi’an UniIC. It became a share-holding company and begins a new era of development in 2023.

Xi’an UniIC is a product and service provider focusing on DRAM (Dynamic Random Access Memory) technologies. Its core business includes standard memory chips, module and system products, embedded DRAM and memory controller chips, as well as ASIC design services. The company has advanced R&D capabilities, rich experience in design, testing and mass production, as well as a well-established product development process and quality management system. The complete product portfolio and category include DRAM KGD, DRAM components, MCP, and DRAM modules, which have filled the gap of many high-end products in the domestic semiconductor memory industry.

Meanwhile, Xi’an UniIC has successfully developed the embedded DRAM chips with ultra-high bandwidth, ultra-large density and ultra-low power consumption; multiple high-performance SoC chips stacked with this embedded DRAM chip using WoW technology have achieved mass production and volume shipment in the past a couple of years. These achievements have also been invited to industry top journals and meetings such as IEDM 2020, CICC 2021, IMW 2021, A-SSCC 2021, ISSCC 2022 and VLSI 2023 to deliver reports and papers.

Xi'an Headquarters
Tel：+86 (0)29 8831 8000   
Fax：+86 (0)29 8845 3299
E-mail：info@unisemicon.comAddress: F/4,Building A, 6th Road, High-tech Development Zone, Xi'an, 710075 China